Sol–gel encapsulation for power electronics utilizing 3-Glycidyloxypropyltriethoxysilane and 3-Mercaptopropyltrimethoxysilane

Abstract 3-Glycidyloxypropyltriethoxysilane and 3-Mercaptosilane were used to prepare a composite together with aluminum oxide. The compound is potential candidate for being as inorganic encapsulation. FTIR results paired head-space analysis revealed hardening of the at above 130 °C degradation sol–gel-network 150 °C. adhesion these compounds was tested via shear tests. It showed, that addition 3-Mercaptopropyltriethoxysilane enhanced on silver significantly. This attributed covalent nature Ag-S bond, which forming compared solely dispersive forces, when 3-Mercaptopropyltriethxysilane not used. By conducting test under temperature activation energies breakages calculated. These coincide well binding energy in case surfaces are examined. In copper surface, mixture dipole–dipole interactions found, since breakage smaller Cu-O bond energy.